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Failure analysis : a practical guide for manufacturers of electronic components and systems / Marius Bâzu, Titu Bâjenescu.

By: Contributor(s): Material type: TextTextSeries: Wiley series in quality and reliability engineeringPublisher: Chichester, West Sussex, U.K. : Wiley, 2011Description: xxii, 317 pages : illustrations ; 25 cmContent type:
  • text
Media type:
  • unmediated
Carrier type:
  • volume
ISBN:
  • 9780470748244
  • 0470748249
Subject(s): DDC classification:
  • 621.381 BA.F 2011 22
LOC classification:
  • TK7870.23 .B395 2011
Other classification:
  • TEC032000
Contents:
Summary: "Manufacturers of electronic components, devices, ICs and electronic systems, also reliability testing engineers and managers in this area"-- Provided by publisher.
List(s) this item appears in: Engineering
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Item type Current library Collection Call number Status Date due Barcode
Books Books The Knowledge Hub Library Engineering 621.381 BA.F 2011 (Browse shelf(Opens below)) Available 210548
Books Books The Knowledge Hub Library Engineering 621.381 BA.F 2011 (Browse shelf(Opens below)) Available 210549
Books Books The Knowledge Hub Library Engineering 621.381 BA.F 2011 (Browse shelf(Opens below)) Available 190409

Includes bibliographical references and index.

Machine generated contents note: 1. Introduction -- 1.1. Three Goals of the Book -- 1.2. Historical Perspective -- 1.2.1. Reliability Prehistory -- 1.2.2. Birth of Reliability as a Discipline -- 1.2.3. Historical Development of Reliability -- 1.2.4. Tools for Failure Analysis -- 1.3. Terminology -- 1.4. State of the Art and Future Trends -- 1.4.1. Technique of Failure Analysis -- 1.4.2. Failure Mechanisms -- 1.4.3. Models for the Physics-of-Failure -- 1.4.4. Future Trends -- 1.5. General Plan of the Book -- References -- 2. Failure Analysis --Why? -- 2.1. Eight Possible Applications -- 2.2. Forensic Engineering -- 2.2.1. FA at System Level -- 2.2.2. FA at Component Level -- 2.3. Reliability Modelling -- 2.3.1. Economic Benefits of Using Reliability Models -- 2.3.2. Reliability of Humans -- 2.4. Reverse Engineering -- 2.5. --Note continued: 3.3.5. Packaging Reliability -- 3.3.6. Improving Batch Reliability: Screening and Burn-In -- 3.4. FA after Fabrication -- 3.4.1. Standard-Based Testing -- 3.4.2. Knowledge-Based Testing -- 3.5. FA during Operation -- 3.5.1. Failure Types during Operation -- 3.5.2. Preventive Maintenance of Electronic Systems -- References -- 4. Failure Analysis --How? -- 4.1. Procedures for Failure Analysis -- 4.2. Techniques for Decapsulating the Device and for Sample Preparation -- 4.2.1. Decapping Techniques -- 4.2.2. Decapsulation Techniques -- 4.2.3. Cross-Sectioning -- 4.2.4. Focused Ion Beam -- 4.2.5. Other Techniques -- 4.3. Techniques for Failure Analysis -- 4.3.1. Electrical Techniques -- 4.3.2. Optical Microscopy -- 4.3.3. Scanning Probe Microscopy (SPM) -- 4.3.4. Microthermographical Techniques -- 4.3.5. Electron Microscopy -- 4.3.6. X-Ray Techniques -- 4.3.7. Spectroscopic Techniques -- 4.3.8. Acoustic Techniques -- 4.3.9. Laser Techniques -- 4.3.10. Holographic Interferometry -- 4.3.11. Emission Microscopy -- 4.3.12. Atom Probe -- 4.3.13. Neutron Radiography -- 4.3.14. Electromagnetic Field Measurements -- 4.3.15. Other Techniques -- References -- 5. Failure Analysis --What? -- 5.1. Failure Modes and Mechanisms at Various Process Steps -- 5.1.1. Wafer Level -- 5.1.2. Packaging -- 5.1.3. Operation -- 5.2. Failure Modes and Mechanisms of Passive Electronic Parts -- 5.2.1. Resistors -- 5.2.2. Capacitors -- 5.2.3. Varistors -- 5.2.4. Connectors -- 5.2.5. Inductive Elements -- 5.2.6. Embedded Passive Components -- 5.3. Failure Modes and Mechanisms of Silicon Bi Technology -- 5.3.1. Silicon Diodes -- 5.3.2. Bipolar Transistors -- 5.3.3. Thyristors and Insulated-Gate Bipolar Transistors --^ 5.3.4. Bipolar Integrated Circuits -- 5.4. Failure Modes and Mechanisms of MOS Technology --Note continued: 5.4.1. Junction Field-Effect Transistors -- 5.4.2. MOS Transistors -- 5.4.3. MOS Integrated Circuits -- 5.4.4. Memories -- 5.4.5. Microprocessors -- 5.4.6. Silicon-on-Insulator Technology -- 5.5. Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies -- 5.5.1. Light-Emitting Diodes -- 5.5.2. Photodiodes -- 5.5.3. Phototransistors -- 5.5.4. Optocouplers -- 5.5.5. Photonic Displays -- 5.5.6. Solar Cells -- 5.6. Failure Modes and Mechanisms of Non-Silicon Technologies -- 5.6.1. Diodes -- 5.6.2. Transistors -- 5.6.3. Integrated Circuits -- 5.7. Failure Modes and Mechanisms of Hybrid Technology -- 5.7.1. Thin-Film Hybrid Circuits -- 5.7.2. Thick-Film Hybrid Circuits -- 5.8. Failure Modes and Mechanisms of Microsystem Technologies -- 5.8.1. Microsystems -- 5.8.2. Nanosystems -- References -- 6. Case Studies -- 6.1. Case Study No. 1: Capacitors -- 6.1.1. Subject -- 6.1.2. Goal -- 6.1.3. Input Data -- 6.1.4. Sample Preparation -- 6.1.5. Working Procedure and Results -- 6.1.6. Output Data -- 6.2. Case Study No. 2: Bipolar Power Devices -- 6.2.1. Subject -- 6.2.2. Goal -- 6.2.3. Input Data -- 6.2.4. Working Procedure for FA and Results -- 6.2.5. Output Data -- 6.3. Case Study No. 3: CMOS Devices -- 6.3.1. Subject -- 6.3.2. Goal -- 6.3.3. Input Data -- 6.3.4. Working Procedure for FA and Results -- 6.3.5. Output Data -- 6.4. Case Study No. 4: MOS Field-Effect Transistors -- 6.4.1. Subject -- 6.4.2. Goal -- 6.4.3. Input Data -- 6.4.4. Sample Preparation -- 6.4.5. Working Procedure for FA -- 6.4.6. Results -- 6.4.7. Output Data -- 6.5. Case Study No. 5: Thin-Film Transistors -- 6.5.1. Subject -- 6.5.2. Goal -- 6.5.3. Input Data -- 6.5.4. Sample Preparation -- 6.5.5. Working Procedure for FA and Results -- 6.5.6. Output Data --Note continued: 6.6. Case Study No. 6: Heterojunction Field-Effect Transistors -- 6.6.1. Subject -- 6.6.2. Goals -- 6.6.3. Input Data -- 6.6.4. Sample Preparation -- 6.6.5. Working Procedure and Results -- 6.6.6. Output Data -- 6.7. Case Study No. 7: MEMS Resonators -- 6.7.1. Subject -- 6.7.2. Goal -- 6.7.3. Input Data -- 6.7.4. Sample Preparation -- 6.7.5. Working Procedure for FA and Results -- 6.7.6. Output Data -- 6.8. Case Study No. 8: MEMS Micro-Cantilevers -- 6.8.1. Subject -- 6.8.2. Goal -- 6.8.3. Input Data -- 6.8.4. Sample Preparation and Working Procedure -- 6.8.5. Results and Discussion -- 6.8.6. Output Data -- 6.9. Case Study No. 9: MEMS Switches -- 6.9.1. Subject -- 6.9.2. Goal -- 6.9.3. Input Data -- 6.9.4. Sample Preparation -- 6.9.5. Working Procedure for FA and Results -- 6.9.6. Output Data -- 6.10. Case Study No. 10: Magnetic MEMS Switches -- 6.10.1. Subject -- 6.10.2. Goal -- 6.10.3. Input Data -- 6.10.4. Sample Preparation -- 6.10.5. Working Procedure for FA and Results -- 6.10.6. Output Data -- 6.11. Case Study No. 11: Chip-Scale Packages -- 6.11.1. Subject -- 6.11.2. Goal -- 6.11.3. Input Data -- 6.11.4. Sample Preparation -- 6.11.5. Working Procedure for FA -- 6.11.6. Results and Discussion -- 6.11.7. Output Data -- 6.12. Case Study No. 12: Solder Joints -- 6.12.1. Subject -- 6.12.2. Goal -- 6.12.3. Input Data -- 6.12.4. Sample Preparation -- 6.12.5. Working Procedure for FA and Results -- 6.12.6. Output Data -- 6.13. Conclusions -- References -- 7. Conclusions -- References.

"Manufacturers of electronic components, devices, ICs and electronic systems, also reliability testing engineers and managers in this area"-- Provided by publisher.

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