Failure analysis : a practical guide for manufacturers of electronic components and systems /
Bâzu, M. I. 1948-
Failure analysis : a practical guide for manufacturers of electronic components and systems / Marius Bâzu, Titu Bâjenescu. - xxii, 317 pages : illustrations ; 25 cm. - Wiley series in quality & reliability engineering . - Wiley series in quality and reliability engineering. .
Includes bibliographical references and index.
Machine generated contents note: 1. Introduction -- 1.1. Three Goals of the Book -- 1.2. Historical Perspective -- 1.2.1. Reliability Prehistory -- 1.2.2. Birth of Reliability as a Discipline -- 1.2.3. Historical Development of Reliability -- 1.2.4. Tools for Failure Analysis -- 1.3. Terminology -- 1.4. State of the Art and Future Trends -- 1.4.1. Technique of Failure Analysis -- 1.4.2. Failure Mechanisms -- 1.4.3. Models for the Physics-of-Failure -- 1.4.4. Future Trends -- 1.5. General Plan of the Book -- References -- 2. Failure Analysis --Why? -- 2.1. Eight Possible Applications -- 2.2. Forensic Engineering -- 2.2.1. FA at System Level -- 2.2.2. FA at Component Level -- 2.3. Reliability Modelling -- 2.3.1. Economic Benefits of Using Reliability Models -- 2.3.2. Reliability of Humans -- 2.4. Reverse Engineering -- 2.5. --Note continued: 3.3.5. Packaging Reliability -- 3.3.6. Improving Batch Reliability: Screening and Burn-In -- 3.4. FA after Fabrication -- 3.4.1. Standard-Based Testing -- 3.4.2. Knowledge-Based Testing -- 3.5. FA during Operation -- 3.5.1. Failure Types during Operation -- 3.5.2. Preventive Maintenance of Electronic Systems -- References -- 4. Failure Analysis --How? -- 4.1. Procedures for Failure Analysis -- 4.2. Techniques for Decapsulating the Device and for Sample Preparation -- 4.2.1. Decapping Techniques -- 4.2.2. Decapsulation Techniques -- 4.2.3. Cross-Sectioning -- 4.2.4. Focused Ion Beam -- 4.2.5. Other Techniques -- 4.3. Techniques for Failure Analysis -- 4.3.1. Electrical Techniques -- 4.3.2. Optical Microscopy -- 4.3.3. Scanning Probe Microscopy (SPM) -- 4.3.4. Microthermographical Techniques -- 4.3.5. Electron Microscopy -- 4.3.6. X-Ray Techniques -- 4.3.7. Spectroscopic Techniques -- 4.3.8. Acoustic Techniques -- 4.3.9. Laser Techniques -- 4.3.10. Holographic Interferometry -- 4.3.11. Emission Microscopy -- 4.3.12. Atom Probe -- 4.3.13. Neutron Radiography -- 4.3.14. Electromagnetic Field Measurements -- 4.3.15. Other Techniques -- References -- 5. Failure Analysis --What? -- 5.1. Failure Modes and Mechanisms at Various Process Steps -- 5.1.1. Wafer Level -- 5.1.2. Packaging -- 5.1.3. Operation -- 5.2. Failure Modes and Mechanisms of Passive Electronic Parts -- 5.2.1. Resistors -- 5.2.2. Capacitors -- 5.2.3. Varistors -- 5.2.4. Connectors -- 5.2.5. Inductive Elements -- 5.2.6. Embedded Passive Components -- 5.3. Failure Modes and Mechanisms of Silicon Bi Technology -- 5.3.1. Silicon Diodes -- 5.3.2. Bipolar Transistors -- 5.3.3. Thyristors and Insulated-Gate Bipolar Transistors --^ 5.3.4. Bipolar Integrated Circuits -- 5.4. Failure Modes and Mechanisms of MOS Technology --Note continued: 5.4.1. Junction Field-Effect Transistors -- 5.4.2. MOS Transistors -- 5.4.3. MOS Integrated Circuits -- 5.4.4. Memories -- 5.4.5. Microprocessors -- 5.4.6. Silicon-on-Insulator Technology -- 5.5. Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies -- 5.5.1. Light-Emitting Diodes -- 5.5.2. Photodiodes -- 5.5.3. Phototransistors -- 5.5.4. Optocouplers -- 5.5.5. Photonic Displays -- 5.5.6. Solar Cells -- 5.6. Failure Modes and Mechanisms of Non-Silicon Technologies -- 5.6.1. Diodes -- 5.6.2. Transistors -- 5.6.3. Integrated Circuits -- 5.7. Failure Modes and Mechanisms of Hybrid Technology -- 5.7.1. Thin-Film Hybrid Circuits -- 5.7.2. Thick-Film Hybrid Circuits -- 5.8. Failure Modes and Mechanisms of Microsystem Technologies -- 5.8.1. Microsystems -- 5.8.2. Nanosystems -- References -- 6. Case Studies -- 6.1. Case Study No. 1: Capacitors -- 6.1.1. Subject -- 6.1.2. Goal -- 6.1.3. Input Data -- 6.1.4. Sample Preparation -- 6.1.5. Working Procedure and Results -- 6.1.6. Output Data -- 6.2. Case Study No. 2: Bipolar Power Devices -- 6.2.1. Subject -- 6.2.2. Goal -- 6.2.3. Input Data -- 6.2.4. Working Procedure for FA and Results -- 6.2.5. Output Data -- 6.3. Case Study No. 3: CMOS Devices -- 6.3.1. Subject -- 6.3.2. Goal -- 6.3.3. Input Data -- 6.3.4. Working Procedure for FA and Results -- 6.3.5. Output Data -- 6.4. Case Study No. 4: MOS Field-Effect Transistors -- 6.4.1. Subject -- 6.4.2. Goal -- 6.4.3. Input Data -- 6.4.4. Sample Preparation -- 6.4.5. Working Procedure for FA -- 6.4.6. Results -- 6.4.7. Output Data -- 6.5. Case Study No. 5: Thin-Film Transistors -- 6.5.1. Subject -- 6.5.2. Goal -- 6.5.3. Input Data -- 6.5.4. Sample Preparation -- 6.5.5. Working Procedure for FA and Results -- 6.5.6. Output Data --Note continued: 6.6. Case Study No. 6: Heterojunction Field-Effect Transistors -- 6.6.1. Subject -- 6.6.2. Goals -- 6.6.3. Input Data -- 6.6.4. Sample Preparation -- 6.6.5. Working Procedure and Results -- 6.6.6. Output Data -- 6.7. Case Study No. 7: MEMS Resonators -- 6.7.1. Subject -- 6.7.2. Goal -- 6.7.3. Input Data -- 6.7.4. Sample Preparation -- 6.7.5. Working Procedure for FA and Results -- 6.7.6. Output Data -- 6.8. Case Study No. 8: MEMS Micro-Cantilevers -- 6.8.1. Subject -- 6.8.2. Goal -- 6.8.3. Input Data -- 6.8.4. Sample Preparation and Working Procedure -- 6.8.5. Results and Discussion -- 6.8.6. Output Data -- 6.9. Case Study No. 9: MEMS Switches -- 6.9.1. Subject -- 6.9.2. Goal -- 6.9.3. Input Data -- 6.9.4. Sample Preparation -- 6.9.5. Working Procedure for FA and Results -- 6.9.6. Output Data -- 6.10. Case Study No. 10: Magnetic MEMS Switches -- 6.10.1. Subject -- 6.10.2. Goal -- 6.10.3. Input Data -- 6.10.4. Sample Preparation -- 6.10.5. Working Procedure for FA and Results -- 6.10.6. Output Data -- 6.11. Case Study No. 11: Chip-Scale Packages -- 6.11.1. Subject -- 6.11.2. Goal -- 6.11.3. Input Data -- 6.11.4. Sample Preparation -- 6.11.5. Working Procedure for FA -- 6.11.6. Results and Discussion -- 6.11.7. Output Data -- 6.12. Case Study No. 12: Solder Joints -- 6.12.1. Subject -- 6.12.2. Goal -- 6.12.3. Input Data -- 6.12.4. Sample Preparation -- 6.12.5. Working Procedure for FA and Results -- 6.12.6. Output Data -- 6.13. Conclusions -- References -- 7. Conclusions -- References.
"Manufacturers of electronic components, devices, ICs and electronic systems, also reliability testing engineers and managers in this area"--
9780470748244 0470748249
2010046383
Electronic apparatus and appliances--Reliability.
Electronic systems--Testing.
System failures (Engineering)--Prevention.
TK7870.23 / .B395 2011
621.381 BA.F 2011
Failure analysis : a practical guide for manufacturers of electronic components and systems / Marius Bâzu, Titu Bâjenescu. - xxii, 317 pages : illustrations ; 25 cm. - Wiley series in quality & reliability engineering . - Wiley series in quality and reliability engineering. .
Includes bibliographical references and index.
Machine generated contents note: 1. Introduction -- 1.1. Three Goals of the Book -- 1.2. Historical Perspective -- 1.2.1. Reliability Prehistory -- 1.2.2. Birth of Reliability as a Discipline -- 1.2.3. Historical Development of Reliability -- 1.2.4. Tools for Failure Analysis -- 1.3. Terminology -- 1.4. State of the Art and Future Trends -- 1.4.1. Technique of Failure Analysis -- 1.4.2. Failure Mechanisms -- 1.4.3. Models for the Physics-of-Failure -- 1.4.4. Future Trends -- 1.5. General Plan of the Book -- References -- 2. Failure Analysis --Why? -- 2.1. Eight Possible Applications -- 2.2. Forensic Engineering -- 2.2.1. FA at System Level -- 2.2.2. FA at Component Level -- 2.3. Reliability Modelling -- 2.3.1. Economic Benefits of Using Reliability Models -- 2.3.2. Reliability of Humans -- 2.4. Reverse Engineering -- 2.5. --Note continued: 3.3.5. Packaging Reliability -- 3.3.6. Improving Batch Reliability: Screening and Burn-In -- 3.4. FA after Fabrication -- 3.4.1. Standard-Based Testing -- 3.4.2. Knowledge-Based Testing -- 3.5. FA during Operation -- 3.5.1. Failure Types during Operation -- 3.5.2. Preventive Maintenance of Electronic Systems -- References -- 4. Failure Analysis --How? -- 4.1. Procedures for Failure Analysis -- 4.2. Techniques for Decapsulating the Device and for Sample Preparation -- 4.2.1. Decapping Techniques -- 4.2.2. Decapsulation Techniques -- 4.2.3. Cross-Sectioning -- 4.2.4. Focused Ion Beam -- 4.2.5. Other Techniques -- 4.3. Techniques for Failure Analysis -- 4.3.1. Electrical Techniques -- 4.3.2. Optical Microscopy -- 4.3.3. Scanning Probe Microscopy (SPM) -- 4.3.4. Microthermographical Techniques -- 4.3.5. Electron Microscopy -- 4.3.6. X-Ray Techniques -- 4.3.7. Spectroscopic Techniques -- 4.3.8. Acoustic Techniques -- 4.3.9. Laser Techniques -- 4.3.10. Holographic Interferometry -- 4.3.11. Emission Microscopy -- 4.3.12. Atom Probe -- 4.3.13. Neutron Radiography -- 4.3.14. Electromagnetic Field Measurements -- 4.3.15. Other Techniques -- References -- 5. Failure Analysis --What? -- 5.1. Failure Modes and Mechanisms at Various Process Steps -- 5.1.1. Wafer Level -- 5.1.2. Packaging -- 5.1.3. Operation -- 5.2. Failure Modes and Mechanisms of Passive Electronic Parts -- 5.2.1. Resistors -- 5.2.2. Capacitors -- 5.2.3. Varistors -- 5.2.4. Connectors -- 5.2.5. Inductive Elements -- 5.2.6. Embedded Passive Components -- 5.3. Failure Modes and Mechanisms of Silicon Bi Technology -- 5.3.1. Silicon Diodes -- 5.3.2. Bipolar Transistors -- 5.3.3. Thyristors and Insulated-Gate Bipolar Transistors --^ 5.3.4. Bipolar Integrated Circuits -- 5.4. Failure Modes and Mechanisms of MOS Technology --Note continued: 5.4.1. Junction Field-Effect Transistors -- 5.4.2. MOS Transistors -- 5.4.3. MOS Integrated Circuits -- 5.4.4. Memories -- 5.4.5. Microprocessors -- 5.4.6. Silicon-on-Insulator Technology -- 5.5. Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies -- 5.5.1. Light-Emitting Diodes -- 5.5.2. Photodiodes -- 5.5.3. Phototransistors -- 5.5.4. Optocouplers -- 5.5.5. Photonic Displays -- 5.5.6. Solar Cells -- 5.6. Failure Modes and Mechanisms of Non-Silicon Technologies -- 5.6.1. Diodes -- 5.6.2. Transistors -- 5.6.3. Integrated Circuits -- 5.7. Failure Modes and Mechanisms of Hybrid Technology -- 5.7.1. Thin-Film Hybrid Circuits -- 5.7.2. Thick-Film Hybrid Circuits -- 5.8. Failure Modes and Mechanisms of Microsystem Technologies -- 5.8.1. Microsystems -- 5.8.2. Nanosystems -- References -- 6. Case Studies -- 6.1. Case Study No. 1: Capacitors -- 6.1.1. Subject -- 6.1.2. Goal -- 6.1.3. Input Data -- 6.1.4. Sample Preparation -- 6.1.5. Working Procedure and Results -- 6.1.6. Output Data -- 6.2. Case Study No. 2: Bipolar Power Devices -- 6.2.1. Subject -- 6.2.2. Goal -- 6.2.3. Input Data -- 6.2.4. Working Procedure for FA and Results -- 6.2.5. Output Data -- 6.3. Case Study No. 3: CMOS Devices -- 6.3.1. Subject -- 6.3.2. Goal -- 6.3.3. Input Data -- 6.3.4. Working Procedure for FA and Results -- 6.3.5. Output Data -- 6.4. Case Study No. 4: MOS Field-Effect Transistors -- 6.4.1. Subject -- 6.4.2. Goal -- 6.4.3. Input Data -- 6.4.4. Sample Preparation -- 6.4.5. Working Procedure for FA -- 6.4.6. Results -- 6.4.7. Output Data -- 6.5. Case Study No. 5: Thin-Film Transistors -- 6.5.1. Subject -- 6.5.2. Goal -- 6.5.3. Input Data -- 6.5.4. Sample Preparation -- 6.5.5. Working Procedure for FA and Results -- 6.5.6. Output Data --Note continued: 6.6. Case Study No. 6: Heterojunction Field-Effect Transistors -- 6.6.1. Subject -- 6.6.2. Goals -- 6.6.3. Input Data -- 6.6.4. Sample Preparation -- 6.6.5. Working Procedure and Results -- 6.6.6. Output Data -- 6.7. Case Study No. 7: MEMS Resonators -- 6.7.1. Subject -- 6.7.2. Goal -- 6.7.3. Input Data -- 6.7.4. Sample Preparation -- 6.7.5. Working Procedure for FA and Results -- 6.7.6. Output Data -- 6.8. Case Study No. 8: MEMS Micro-Cantilevers -- 6.8.1. Subject -- 6.8.2. Goal -- 6.8.3. Input Data -- 6.8.4. Sample Preparation and Working Procedure -- 6.8.5. Results and Discussion -- 6.8.6. Output Data -- 6.9. Case Study No. 9: MEMS Switches -- 6.9.1. Subject -- 6.9.2. Goal -- 6.9.3. Input Data -- 6.9.4. Sample Preparation -- 6.9.5. Working Procedure for FA and Results -- 6.9.6. Output Data -- 6.10. Case Study No. 10: Magnetic MEMS Switches -- 6.10.1. Subject -- 6.10.2. Goal -- 6.10.3. Input Data -- 6.10.4. Sample Preparation -- 6.10.5. Working Procedure for FA and Results -- 6.10.6. Output Data -- 6.11. Case Study No. 11: Chip-Scale Packages -- 6.11.1. Subject -- 6.11.2. Goal -- 6.11.3. Input Data -- 6.11.4. Sample Preparation -- 6.11.5. Working Procedure for FA -- 6.11.6. Results and Discussion -- 6.11.7. Output Data -- 6.12. Case Study No. 12: Solder Joints -- 6.12.1. Subject -- 6.12.2. Goal -- 6.12.3. Input Data -- 6.12.4. Sample Preparation -- 6.12.5. Working Procedure for FA and Results -- 6.12.6. Output Data -- 6.13. Conclusions -- References -- 7. Conclusions -- References.
"Manufacturers of electronic components, devices, ICs and electronic systems, also reliability testing engineers and managers in this area"--
9780470748244 0470748249
2010046383
Electronic apparatus and appliances--Reliability.
Electronic systems--Testing.
System failures (Engineering)--Prevention.
TK7870.23 / .B395 2011
621.381 BA.F 2011
